Semiconductor structure and manufacturing method thereof

ABSTRACT

The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional of application Ser. No. 15/156,764,filed May 17, 2016, issuing as U.S. Pat. No. 9,786,619, which claimspriority from Provisional Application No. 62/273,461 filed Dec. 31,2015, the disclosures of which are hereby incorporated by reference inits entirety.

BACKGROUND

Electronic equipment involving semiconductive devices are essential formany modern applications. Technological advances in materials anddesigns have produced generations of semiconductive devices where eachgeneration has smaller and more complex circuits than the previousgeneration. In the course of advancement and innovation, functionaldensity (i.e., the number of interconnected devices per chip area) hasgenerally increased while geometric size (i.e., the smallest componentthat can be created using a fabrication process) has decreased. Suchadvances have increased the complexity of processing and manufacturingsemiconductive devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a schematic view of a semiconductor structure in accordancewith some embodiments of the present disclosure.

FIG. 1B is a schematic view of a semiconductor structure in accordancewith some embodiments of the present disclosure.

FIG. 1C is a schematic view of a semiconductor structure in accordancewith some embodiments of the present disclosure.

FIGS. 2A-2Q are schematic views of manufacturing a semiconductorstructure in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure is directed to a semiconductor structure with animproved bond pad design. The bond pad is composed of materials withgreater resistance to stress, such as pull stress or shear stress,during the manufacturing or packaging of the semiconductor structure. Inaddition, the semiconductor structure exhibits better bondingproperties. Thus, the risk of structure cracking or peeling iseffectively mitigated.

FIG. 1A is a schematic view of a semiconductor structure 100, inaccordance with some embodiments of the present disclosure. Thesemiconductor structure 100 comprises a first semiconductor device 110and a second semiconductor device 120. The first semiconductor device110 comprises a first semiconductive substrate 112 and a firstinterconnect structure 114. The second semiconductor device 120comprises a second semiconductive substrate 122 and a secondinterconnect structure 124.

The second semiconductor device 120 is configured to perform specificfunctions and communicate with the first semiconductor device 110. Insome embodiments, the second semiconductor device 120 may include alogic circuit. In some embodiments, the second semiconductor device 120may further include memory cells or other electrical components. In someembodiments, the second semiconductive substrate 122 may include amyriad of passive or active components (not shown) disposed on a surface122A facing the second interconnect structure 124.

The second semiconductive substrate 122 includes a semiconductormaterial such as silicon. In some embodiments, the second semiconductivesubstrate 122 may include other semiconductor materials, such as silicongermanium, silicon carbide, gallium arsenide, or the like. In someembodiments, the second semiconductive substrate 122 is a p-typesemiconductive substrate (acceptor type) or n-type semiconductivesubstrate (donor type). Alternatively, the second semiconductivesubstrate 122 includes another elementary semiconductor, such asgermanium; a compound semiconductor including silicon carbide, galliumarsenic, gallium phosphide, indium phosphide, indium arsenide, and/orindium antimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs,AlGaAs, GaInAs, GaInP, and/or GaInAsP; or combinations thereof. In yetanother alternative, the second semiconductive substrate 122 is asemiconductor-on-insulator (SOI). In other alternatives, the secondsemiconductive substrate 122 may include a doped epi layer, a gradientsemiconductor layer, and/or a semiconductor layer overlying anothersemiconductor layer of a different type, such as a silicon layer on asilicon germanium layer.

The second interconnect structure 124 is disposed over the secondsemiconductive substrate 122. In some embodiments, the secondinterconnect structure 124 is disposed between the first interconnectstructure 114 and the second semiconductive substrate 122. The secondinterconnect structure 124 is configured to electrically coupleelectrical components within the second semiconductive substrate 122. Insome embodiments, the second interconnect structure 124 is configured toelectrically couple the second semiconductive substrate 122 with adevice or component external to the second semiconductor device 120. Inthe present embodiment, the second interconnect structure 124electrically couples the second semiconductive substrate 122 with thefirst interconnect structure 114 of the first semiconductor device 110.The second interconnect structure 124 may include multiple metal layers.Each of the metal layers may include conductive wires or lines and iselectrically coupled to an adjacent overlaying or underlying metal layerthrough at least one metal via. In the present embodiment, metal layers131, 133, 135 and 137 are disposed in a layered structure and areinterconnected through corresponding metal vias 132, 134 and 136. Thenumbers and patterns of the metal layers and vias of the secondinterconnect structure 124 are provided for illustration. Other numbersof metal layers, metal vias, or conductive wires and alternative wiringpatterns are also within the contemplated scope of the presentdisclosure.

Moreover, the aforesaid metal layers and metal vias are electricallyinsulated from other components. The insulation may be achieved byinsulating materials. In some embodiments, the remaining portion of thesecond interconnect structure 124 may be filled with an inter-metaldielectric (IMD) 123. The dielectric material of IMD 123 may be formedof oxides, such as un-doped Silicate Glass (USG), Fluorinated SilicateGlass (FSG), low-k dielectric materials, or the like. The low-kdielectric materials may have k values lower than 3.8, although thedielectric materials of the IMD 123 may also be close to 3.8. In someembodiments, the k values of the low-k dielectric materials are lowerthan about 3.0, and may be lower than about 2.5.

The first semiconductor device 110 is configured to perform specificfunctions and communicate with the second semiconductor device 120. Insome embodiments, the first semiconductor device 110 may be a sensingdevice, for example, a backside image (BSI) sensor device configured tocapture image data. In some embodiments, the first semiconductivesubstrate 112 may include a myriad of passive or active components (notshown) disposed on a surface 112B facing the first interconnectstructure 114.

The first interconnect structure 114 is disposed against the firstsemiconductive substrate 112. In some embodiments, the firstinterconnect structure 114 is disposed between the second interconnectstructure 124 and the first semiconductive substrate 112. In someembodiments, the first interconnect structure 114 is configured toelectrically couple the components of the first semiconductive substrate112 with a device or component external to the first semiconductordevice 110. In the present embodiment, the first interconnect structure114 electrically couples the first semiconductive substrate 112 with thesecond interconnect structure 124 of the second semiconductor device120. The first interconnect structure 114 may include multiple metallayers. Each of the metal layers includes at least one conductive lineand is electrically coupled to an adjacent metal layer through at leastone metal via. In the present embodiment, metal layers 141, 143, 145 and147 are disposed in the second interconnect structure 114 and areinterconnected through metal vias 142, 144 and 146.

In some embodiments, the remaining portion of the interconnect structure114 may be filled with an IMD 113. The dielectric material for the IMD113 may be formed of oxides, such as un-doped Silicate Glass (USG),Fluorinated Silicate Glass (FSG), low-k dielectric materials, or thelike. The low-k dielectric materials may have k values lower than 3.8,although the dielectric materials of the IMD 113 may be also close to3.8. In some embodiments, the k values of the low-k dielectric materialsare lower than about 3.0, and may be lower than about 2.5.

In some embodiments, the first interconnect structure 114 furthercomprises several bond pads 154 on a surface 114A facing the secondinterconnect structure 124. In some embodiments, the second interconnectstructure 124 comprises several bond pads 152 on a surface 124A facingthe first interconnect structure 114. The bond pads 154 are aligned withcorresponding bond pads 152 such that the first semiconductor device 110and the second semiconductor device 120 are electrically bonded. In someembodiments, the bond pads 154 and 152 may protrude from the surface114A and 124A, respectively. In some embodiments, the bond pads 152 areplanar with the surface 114A. In some embodiments, the bond pads 154 areplanar with the surface 124A. In some embodiments, the bond pads 152 and154 are planar with the surface 114A and 124A, respectively, such thatthe surface 114A is in contact with the surface 124A.

The first semiconductive substrate 112 is disposed above the firstinterconnect structure 114. The first semiconductive substrate 112 mayinclude silicon, silicon germanium, silicon carbide, gallium arsenide,and/or germanium. Alternatively, the first semiconductive substrate 112may include a compound semiconductor including silicon carbide, galliumarsenic, gallium phosphide, indium phosphide, indium arsenide, and/orindium antimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs,AlGaAs, GaInAs, GaInP, and/or GaInAsP; or combinations thereof. In someembodiments, the first semiconductive substrate 112 may be formed ofmaterials similar to the second semiconductive substrate 122. In someembodiments, the first semiconductive substrate 112 may includematerials different from the second semiconductive substrate 122.

In some embodiments, the first semiconductor device 110 may include adielectric layer 162 between the semiconductive substrate 112 and thesecond interconnect structure 114. In some embodiments, the firstsemiconductor device 110 may include a dielectric layer 164 external butagainst the semiconductive substrate 112. The dielectric layer 162 anddielectric layer 164 are respectively disposed on opposite sides of thesemiconductive substrate 112. The dielectrics 162 and 164 may include avariety of dielectric materials and may, for example, be an oxide (e.g.,Ge oxide), an oxynitride (e.g., GaP oxynitride), silicon dioxide (SiO₂),a nitrogen-bearing oxide (e.g., nitrogen-bearing SiO₂), a nitrogen-dopedoxide (e.g., N₂-implanted SiO₂), silicon oxynitride (Si_(x)O_(y)N_(z)),and the like. In some embodiments, the dielectric 162 is formed of thesame materials as that of the dielectric 164. In some embodiments, thedielectric 162 is formed of different materials from that of thedielectric 164.

In some embodiments, the first semiconductive substrate 112 includes afirst via 160. The first via 160 comprises a terminal 168 and adielectric 166. In some embodiments, the dielectric 166 surrounds theterminal 168 in a lateral direction substantially parallel to a topsurface 112A of the first semiconductive substrate 112. In someembodiments, the dielectric 166 includes multiple dielectric materials.Alternatively, the dielectric 166 includes a multi-layer structure. Theterminal 168 is extended through the semiconductive substrate 112 andconfigured to electrically couple the first interconnect structure 114with an external component through a connector 172. In some embodiments,the dielectric 166 in the first via 160 includes a second via 160′. Theterminal 168 is disposed in the second via 160′. The dielectric 166surrounds the second via 160′ in a lateral direction substantiallyparallel to a top surface 112A of the first semiconductor substrate 112.In some embodiments, the terminal 168 electrically connects theconnector 172 with the metal layer 141 of the first interconnectstructure 114. In some embodiments, the connector 172 is a wire bond ora solder bump.

In some embodiments, the semiconductor structure 100 may include anunder bump metallurgy (UBM) 174 between the first via 160 and theconnector 172. The UBM 174 is configured to provide better adhesion ofthe connector 172. In some embodiments, the UBM 174 covers the first via160. In some embodiments, the UBM 174 includes a top surface higher thana top surface of the dielectric layer 164.

FIG. 1B is an enlarged schematic view of a portion of the semiconductorstructure 100 in FIG. 1A, in accordance with some embodiments of thepresent disclosure. Specifically, the first semiconductor device 110 isillustrated with more details. In some embodiments, the firstsemiconductive substrate 112 further comprises a dielectric 167. In someembodiments, the dielectric 167 is in the first via 160 and lining alongsidewalls of the first via 160. In some embodiments, the dielectric 167surrounds the dielectric 166 and the terminal 168 from a lateraldirection substantially parallel to the top surface 112A of the firstsemiconductor substrate 112. Referring to FIG. 1B, the dielectric 167surrounds a lateral side and a bottom side of the dielectric 166.

In some embodiments, the first semiconductive substrate 112 furthercomprises a dielectric 165. A portion of the dielectric 165 is in thefirst via 160. The dielectric 165 is disposed between the dielectric 162and the bottom side of the dielectric 167. In some embodiments, thedielectric 165 has a top surface which includes an area larger than thecross-sectional area of the first via 160. In the present embodiments,the terminal 168 is electrically connected with the metal layer 141 andpasses through the dielectrics 166, 167, 162 and 165. In other words,the terminal 168 is surrounded by the dielectrics 166, 167, 162 and 165in a lateral direction substantially parallel to the top surface 112A.

In some embodiments, the metal layer 141 includes conductive materialssuch as gold, silver and tungsten. The metal layer 141 includes athickness T measured from a direction perpendicular to the surface 112A.In some embodiments, the thickness T is from about 500 Å to about 3000Å. In some embodiments, the thickness T is from about 1000 Å to about3000 Å. In some embodiments, the thickness T is from about 1000 Å toabout 2000 Å.

The terminal 168 is illustrated with shading in FIG. 1A. The terminal168 is also illustrated with shading in FIG. 1B in a similar shapealthough not specifically labeled. In some embodiments, the terminal 168serves as a conductive plug electrically coupling the connector 172 withthe first interconnect structure 114. In some embodiments, the terminal168 may be a bond pad. The bond pad 168 has a height H measured from abottom surface 168B to a top surface 168A. In some embodiments, theheight H may be from about 16,000 Å to about 35,000 Å. In someembodiments, the height H may be from about 20,000 Å to about 30,000 Å.In some embodiments, the height H may be from about 24,000 Å to about28,000 Å.

The dielectric 166 has a top surface 166A. In some embodiments, the topsurface 166A has a flat shape. In some embodiments, the top surface 166Ahas a curved shape such as a concave surface. In the presentembodiments, the top surface 166A has an upwardly concave surface. Thecurved shape of the top surface 166A may be due to a dishing effect of aplanarization process, such as the chemical mechanical polishing (CMP)operation.

In some embodiments, the dielectric 167 includes a top surface 167A. Insome embodiments, the top surface 167A includes a flat shape. In someembodiments, the top surface 167A includes a curved shape such as aconcave shape. For example, the top surface 167A may include an upwardlyconcave shape.

In some embodiments, the top surface 168A has a flat shape. In someembodiments, the top surface 168A has a curved shape. In someembodiments, the top surface 168A has a concave shape, such as adownwardly concave shape.

In some embodiments, the bond pad 168 has a sidewall 168C interfacingwith the dielectric 166. The bond pad 168 has a top width W1 measuredalong a top level of the sidewall 168C and a bottom width W2 measuredalong the bottom surface 168B. In some embodiments, the top width W1 islarger than the bottom width W2. In some embodiments, the bond pad 168includes a tapered shape from the top surface 168A to the bottom surface168B.

In some embodiments, the top surface 168A is lower than the top surface166A of the dielectric 166. In some embodiments, the top surface 168Ameets with the top surface 166A of the dielectric 166. In someembodiments, the top surface 168A is lower than the top surface 112A ofthe dielectric 164. In some embodiments, the top surface 168A issubstantially coplanar or leveled with the top surface 112A of thedielectric 164. In some embodiments, the top surface 168A is lower thana top surface 167A of the dielectric 167.

The bond pad 168 electrically couples to the metal layer 141 at thebottom surface 168B. In some embodiments, the bond pad 168 couples tothe metal layer 141 via the single contact 168B. In some embodiments,the bond pad 168 comprises a flat bottom surface 168B in contact withthe metal layer 141.

The bond pad 168 comprises at least two layers. In the presentembodiment, the bond pad 168 (illustrated with shading while not labeledin FIG. 1B) comprises a first layer 169 and a second layer 170. Thefirst layer 169 is coupled to the metal layer 141 of the firstinterconnect structure 114. In some embodiments, the first layer 169includes a tapered shape from a cross-sectional view. In someembodiments, the first layer 169 may include a conductive material withYoung's modulus from about 150 gigapascals (GPa) to about 250 GPa. Insome embodiments, the first layer 169 may include a conductive materialwith Young's modulus from about 180 GPa to about 220 GPa. In someembodiments, the first layer 169 may include a conductive material withYoung's modulus from about 190 GPa to about 210 GPa. In someembodiments, the first layer 169 may include metal such as gold, silver,copper, tungsten or nickel.

In some embodiments, the first layer 169 may include a conductivematerial with a weight percentage concentration from about 85% to about100%. In some embodiments, the first layer 169 may include a conductivematerial with a weight percentage concentration from about 90% to about100%. In some embodiments, the first layer 169 may include a conductivematerial with a weight percentage concentration from about 93% to about95%. In some embodiments, the conductive material of the first layer 169includes gold, silver, copper, tungsten or nickel.

The first layer 169 includes a height H1 measured from the bottomsurface 168B to an upper surface 169A. In some embodiments, the heightH1 is from about 15,000 Å to about 30,000 Å. In some embodiments, theheight H1 is from about 15,000 Å to about 25,000 Å. In some embodiments,the height H1 is from about 20,000 Å to about 25,000 Å.

The second layer 170 electrically connects the first layer 169 with theUBM 174. In some embodiments, the second layer 170 is exposed from thedielectric 166. The second layer 170 has a top surface which is the topsurface of the bond pad 168 and labeled as 168A. In some embodiments,the top surface 168A of the second layer 170 meets with the top surface166A of the dielectric 166. In some embodiments, the top surface 168A islower than the top surface 166A of the dielectric 166. In someembodiments, the second layer 170 includes a quadrilateral shape. Insome embodiments, the second layer 170 includes a trapezoidal shape.

In some embodiments, the top surface 168A of the second layer 170 has aflat shape. In some embodiments, the top surface 168A of the secondlayer has a curved shape. In some embodiments, the top surface 168A ofthe second layer has a concave shape, such as a downwardly concaveshape.

In some embodiments, the second layer 170 may include a conductivematerial with Young's modulus from about 50 GPa to about 120 GPa. Insome embodiments, the second layer 170 may include a conductive materialwith Young's modulus from about 60 GPa to about 100 GPa. In someembodiments, the second layer 170 may include a conductive material withYoung's modulus from about 70 GPa to about 80 GPa. In some embodiments,the second layer 170 may include metal such as gold, silver, copper,tungsten or nickel.

In some embodiments, the second layer 170 may include a conductivematerial with a weight percentage concentration from about 95% to about100%. In some embodiments, the second layer 170 may include a conductivematerial with a weight percentage concentration from about 99% to about100%. In some embodiments, the second layer 170 may include metal suchas gold, silver, copper, tungsten or nickel.

The second layer 170 includes a height H2 measured from the surface 169Ato the upper surface 168A. In the embodiments, the height H2 is fromabout 500 Å to about 3000 Å. In the embodiments, the height H2 is fromabout 1000 Å to about 3000 Å. In the embodiments, the height H2 is fromabout 1000 A to about 2000 Å.

In some embodiments, a ratio of Young's modulus between the first layer169 and the second layer 170 is from about 1.5 to about 3.5. In someembodiments, a ratio of Young's modulus between the first layer 169 andthe second layer 170 is from about 2.0 to about 3.0. In someembodiments, a ratio of Young's modulus between the first layer 169 andthe second layer 170 is from about 2.4 to about 2.6.

FIG. 1C is an enlarged schematic view of a portion of the semiconductorstructure 100 in FIG. 1A, in accordance with some embodiments of thepresent disclosure. Specifically, the first semiconductor device 110 isillustrated with more details. Referring to FIG. 1C, the top surface168A is higher than the top surface 166A of the dielectric 166. In someembodiments, the top surface 168A is higher than the top surface 112A ofthe dielectric 164. In some embodiments, the top surface 168A is higherthan the top surface 167A of the dielectric 167. In some embodiments, aportion of the bond pad 168 covers a portion of the dielectric 166. Insome embodiments, a cap portion of the bond pad 168 extends over thedielectric 166. In some embodiments, the cap portion of the bond pad 168extends along a direction parallel to the top surface 112A of the firstsemiconductive substrate 112. In some embodiments, the dielectric 166 iscovered partially by the UBM 174 and partially by the bond pad 168.

In some embodiments, the second layer 170 covers a portion of the topsurface 166A of the dielectric 166. In some embodiments, the secondlayer 170 extends over the dielectric 166. In some embodiments, the topsurface 168A of the second layer 170 has a flat shape. In someembodiments, the top surface 168A of the second layer 170 has a curvedshape, such as a concaved shape. In some embodiments, the upper surface169A meets with a top level of the sidewall 168C such that the secondlayer 170 is higher than the top surface 166A of the dielectric 166. Insome embodiments, the cap portion of the second layer 170 includes aquadrilateral shape. In some embodiments, the cap portion of the secondlayer 170 includes a trapezoidal shape. In some embodiments, the capportion of the second layer 170 covers a portion of the dielectric 166.

FIG. 2A to FIG. 2Q show cross-sectional views of the semiconductorstructure 100 of FIG. 1A fabricated at various stages, in accordancewith some embodiments of the present disclosure. In FIG. 2A, the firstsemiconductive substrate 112 is provided. In some embodiments, at leastone structure of a sensing device (not shown) may be formed in the firstsemiconductive substrate 112. The first semiconductive substrate 112 hasa first dopant type, such as a P-type.

In some embodiments, a dielectric 162 is blanket deposited at a topmostlevel of the first semiconductive substrate 112. The dielectric 162 maybe formed by vapor deposition or spin coating. “Vapor deposition” refersto processes of depositing materials on a substrate though the vaporphase. Vapor deposition processes include any process such as, but notlimited to, chemical vapor deposition (CVD) and physical vapordeposition (PVD). Examples of vapor deposition methods include hotfilament CVD, radio-frequency CVD (rf-CVD), laser CVD (LCVD), conformaldiamond coating processes, metal-organic CVD (MOCVD), sputtering,thermal evaporation PVD, ionized metal PVD (IMPVD), electron beam PVD(EBPVD), reactive PVD, atomic layer deposition (ALD), plasma-enhancedCVD (PECVD), high-density plasma CVD (HDPCVD), low-pressure CVD (LPCVD)and the like. In some embodiments, the dielectric 162 includes siliconoxide or silicon nitride. In some embodiments, the upper most leveldielectric 162 is also configured as a passivation layer.

Referring to FIG. 2B, the first interconnect structure 114 is formedover the first semiconductive substrate 112. The first interconnectstructure 114 may be formed of stacked metal layers from a bottom layerto a top layer. For example, the metal layer 147 is formed by depositinga mask layer (not separately shown) on the first semiconductivesubstrate 112. The mask layer is patterned through an etching operationto form desired patterns for the metal layer 141. Then, conductivematerials are filled in the etched patterns. The mask layer is stripedby a removing operation after the pattern is filled with conductivematerials. The IMD material 113 may be filled among the conductivematerials of the metal layer 141. Similarly, the conductive via layer142 is formed over the metal layer 141 in order to generate a conductiveconnection between the metal layer 141 and the overlaying metal layer142. The metal layers 143, 145 and 147 are formed in sequence along withthe intervening conductive via layers 144 and 146. A portion of themetal layer 147 is exposed from the first interconnect structure 114.

Referring to FIG. 2C, several bond pads 154 are formed at a topmostlevel of the first interconnect structure 114. In some embodiments, eachof the bond pads 154 has a top surface 154A higher than a top surface113A of the IMD 113. In some embodiments (not shown), the top surface113A may be configured to level with the top surface 154A such that thefirst interconnect structure 114 has a planarized top surface 114A ofFIG. 1A. The first semiconductive substrate 112 and the firstinterconnect structure 114 constitutes the first semiconductor device110.

FIGS. 2D-2F show cross-sectional views of the second semiconductordevice 120 fabricated at various stages, in accordance with someembodiments of the present disclosure. The second semiconductivesubstrate 122 is provided as shown in FIG. 2D. In some embodiments, atleast one active or passive structure (not shown) may be formed in thefirst semiconductive substrate 122. The first semiconductive substrate122 has a first dopant type, such as a P-type.

Referring to FIG. 2E, the second interconnect structure 124 is formedover the second semiconductive substrate 122. The second interconnectstructure 124 may be formed of stacked metal layers. In someembodiments, the second interconnect structure 124 is formed from bottomto top, wherein such process is similar to the formation of the firstinterconnect structure 114. For example, the metal layers 131, 133, 135and 137 are formed over one another along with corresponding interveningconductive via layers 132, 134 and 136. The IMD 123 is filled among theaforesaid metal layers in order to complete the second interconnectstructure 124. A portion of the metal layer 131 is exposed from thefirst interconnect structure 114.

Referring to FIG. 2F, several bond pads 152 are formed at a topmostlevel of the second interconnect structure 124. In some embodiments,each of the bond pads 152 has a top surface 152A higher than a topsurface 123A of the IMD 123. In some embodiments (not shown), the topsurface 123A may be configured to level with the top surface 152A suchthat the first interconnect structure 124 has a planarized top surface124A of FIG. 1A. The second semiconductive substrate 122 and the secondinterconnect structure 124 constitutes the first semiconductor device120.

The first semiconductor device 110 is flipped and bonded with thesemiconductor device 120 as shown in FIG. 2G. The bond pads 154 areelectrically bonded with corresponding bond pads 152.

Referring to FIG. 2H, the first semiconductive substrate 112 is thinneddown. The thinned semiconductive substrate 112 is thinned to a thicknessL measured from a bottom surface 112C to the top surface 112A. In someembodiments, the thickness L is from about 20 um to about 500 um. Insome embodiments, the thickness L is from about 20 um to about 300 um.In some embodiments, the thickness L is from about 40 um to about 120um.

In FIG. 21, the dielectric 164 is formed over the first semiconductordevice 110. In some embodiments, the dielectric 164 may be configured asa passivation layer. In some embodiments, the dielectric 164 includessilicon oxide or silicon nitride. The dielectric 164 may be formed by adeposition operation, such as hot filament CVD, rf-CVD, laser CVD(LCVD), conformal diamond coating processes, MOCVD, thermal evaporationPVD, HDPCVD, LPCVD and the like.

In FIG. 2J, the first via 160 is formed in the first semiconductorsubstrate 112. The first via 160 may be formed by deposition of a masklayer. The mask layer can be a photoresist mask or hard mask, such asnitride. Then, an etching operation is performed with the mask layer inplace. The first via 160 is formed by a suitable etching process, suchas a dry etch operation. In some embodiments, the dry etch in thepresent operation includes a reactive ion etch (RIE) adoptingfluorine-containing gases. The mask layer is removed after the first via160 is completed.

In FIG. 2K, a dielectric material 167 is conformally formed over thefirst semiconductive substrate 112. In some embodiments, the dielectricmaterial 167 is a different material from that of the dielectric 164. Insome embodiments, the dielectric 167 is formed over the dielectric 164,and the sidewalls and bottom surface of the first via 160. Thedielectric 167 may be formed by a suitable deposition process, such as aCVD or PVD operation.

In FIG. 2L, a dielectric material 182 is blanket deposited over thedielectric 167. The dielectric material 182 fills the first via 160. Insome embodiments, the dielectric material 182 is different from that ofthe dielectric 167. In some embodiments, the dielectric material 182 isdifferent from that of the dielectric 164.

In FIG. 2M, a removal operation is performed to remove excessivematerials above the dielectric layer 164. After the removal operation, aportion of the dielectric layer 167 is left on the sidewalls and bottomsurface of the first via 160. As a result, the dielectric 166 is formedin the first via 160. Also, the dielectric 164 is exposed by the removaloperation. In some embodiments, the removal operation may be performedby a suitable process, such as a chemical mechanical polishing (CMP)operation. In some embodiments, a portion of the top surface of thefilled first via 160, which includes the surfaces 166A and 167A, mayinclude a curve surface due to the dishing effect. In some embodiments,the top surface of the first via 160 may include a concave shape, suchas an upwardly concave shape. Therefore, the dielectric 166 may includea top surface 166A with a curved shape. For example, the top surface166A may include an upwardly concave shape. In some embodiments, thedielectric 167 may include a top surface 166A with a curved shape. Forexample, the top surface 167A may include an upwardly concave shape.

In FIG. 2N, the second via 160′ is formed in the dielectric 166. Thesecond via 160′ is extended downward and exposes the metal layer 141.The second via 160′ may be formed by deposition of a mask layer. Then,an etching operation is performed with the mask layer in place. Thesecond via 160′ is formed by a suitable etching process, such as a dryetch operation. In some embodiments, the dry etch in the presentoperation includes a reactive ion etch (RIE) adoptingfluorine-containing gases. The mask layer is removed after the secondvia 160′ is completed.

Referring to FIG. 20, the first layer 169 is formed in the second via160′. The first layer 169 may be formed by a by a variety of techniques,e.g., electroplating, electroless plating, high-density ionized metalplasma (IMP) deposition, high-density inductively coupled plasma (ICP)deposition, sputtering, PVD, CVD, LPCVD, plasma-enhanced chemical vapordeposition (PECVD), and the like.

Referring to FIG. 2P, the second layer 170 is formed over the second via160′. Also, the second layer 170 is formed on the first layer 169. Thesecond layer 170 may be formed by a by a variety of techniques, e.g.,electroplating, electroless plating, high-density ionized metal plasma(IMP) deposition, high-density inductively coupled plasma (ICP)deposition, sputtering, PVD, CVD, LPCVD, plasma-enhanced chemical vapordeposition (PECVD), and the like.

Referring to FIG. 2Q, the UBM 174 is formed over the first via 160. Insome embodiments, the UBM 174 covers a portion of the dielectric 164.Then, the connector 172 is formed over the UBM 174.

In view of the foregoing, the present disclosure provides asemiconductor structure in which an improved bond pad is proposed forenhancing structural resistance to foreign stress. The bond pad maycomprise at least two layers of conductive materials. The bond pad isdisposed in a via. Among the two layers of the bond pad, a first layercomprises a conductive material, such as nickel. Also, the second layercomprises a conductive material, such as gold. In addition, the secondlayer comprises a cap portion covering the via. Thus, the bond padexhibits greater stress resistance. The risk of structure cracking orpeeling is alleviated accordingly.

The present disclosure provides a semiconductor structure. Thesemiconductor structure comprises a semiconductive substrate and aninterconnect structure over the semiconductive substrate. Thesemiconductor structure also comprises a bond pad in the semiconductivesubstrate and coupled to the metal layer. The bond pad comprises twoconductive layers.

The present disclosure provides a semiconductor structure comprising afirst semiconductor device and a second semiconductor device. The firstsemiconductor device comprises a first semiconductive substrate, a firstinterconnect structure over the first semiconductive substrate, aterminal in the first semiconductive substrate where the terminal isconfigured to electrically couple the first interconnect structure witha connector over the first semiconductive substrate, and a dielectricsurrounding the terminal. The second semiconductor device comprises asecond semiconductive substrate. The second semiconductor device alsocomprises a second interconnect over the second semiconductive substrateand configured to bond with the first interconnect structure. Theterminal comprises a first layer connected to the second interconnectstructure and a second layer extending over the dielectric.

The present disclosure provides a method of manufacturing asemiconductor structure. The method comprises: providing a firstsemiconductive substrate; forming a first interconnect structure overthe first semiconductive substrate; providing a second semiconductivesubstrate; forming a second interconnect structure over the firstsemiconductive substrate; bonding the first interconnect structure withthe second interconnect structure; forming a first via in the firstsemiconductive substrate, the via exposing a portion of a top surface ofa metal layer in the first interconnect structure; depositing adielectric in the first via; forming a second via in the dielectric;depositing a first conductive layer in the second via; and depositing asecond conductive layer over the first conductive layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor structure, comprising: asemiconductive substrate; an interconnect structure over thesemiconductive substrate; a dielectric layer within the semiconductivesubstrate; and and a bond pad coupled to the interconnect structure, thebond pad comprising a via extending through the semiconductive structureto the interconnect structure and having sidewalls defined by thedielectric layer, wherein a first conductive layer fills a bottomportion of the via and a second conductive layer is disposed on thefirst conductive layer and extends over the dielectric layer.
 2. Thesemiconductor structure of claim 1, wherein the first conductivematerial has a Young's modulus from about 180 GPa to about 220 GPa. 3.The semiconductor structure of claim 2, wherein the second conductivelayer has a Young's modulus from about 50 GPa to about 120 GPa.
 4. Thesemiconductor structure of claim 1, wherein the second conductive layeris a gold layer and the first conductive layer is a nickel layer, thegold layer being configured to connect to a solder bump.
 5. Thesemiconductor structure of claim 4, wherein the nickel layer comprises aheight from about 20,000 Å to about 25,000 Å.
 6. The semiconductorstructure of claim 1, wherein a ratio of Young's modulus between thefirst and second conductive layers is from about 1.5 to about 3.5. 7.The semiconductor structure of claim 1, wherein the via comprises a topsurface with an upwardly concave shape.
 8. The semiconductor structureof claim 1, wherein the bond pad comprises a cap portion extending alonga direction substantially parallel to a top surface of thesemiconductive substrate.
 9. The semiconductor structure of claim 1,wherein the bond pad comprises a tapered shape.
 10. The semiconductorstructure of claim 1, wherein the bond pad comprises a top surface and abottom surface, and the top surface comprises a first width larger thana second width of the bottom surface.
 11. The semiconductor structure ofclaim 1, wherein the dielectric comprises a multi-layer structure. 12.The semiconductor structure of claim 1, wherein the bond pad covers aportion of the dielectric.
 13. A semiconductor structure, comprising: afirst semiconductor device comprising: a first semiconductive substrate;a first interconnect structure over the first semiconductive substrate;a terminal in the first semiconductive substrate, the terminal beingconfigured to electrically couple the first interconnect structure witha connector over the first semiconductive substrate; and a dielectricsurrounding the terminal; and a second semiconductor device comprising:a second semiconductive substrate; and a second interconnect structureover the second semiconductive substrate and configured to bond with thefirst interconnect structure, the terminal comprising a first layerconnected to the second interconnect structure and a second layerextending over the dielectric.
 14. A semiconductor structure of claim12, wherein the first layer comprises a tapered shape.
 15. Thesemiconductor structure of claim 12, further comprising a seconddielectric surrounding the first dielectric.
 16. The semiconductorstructure of claim 14, wherein the second dielectric has a top surfacewith a curved shape.
 17. A semiconductor structure, comprising: a firstsemiconductive substrate; a first interconnect structure over a firstsurface of the first semiconductive substrate, the first semiconductivesubstrate having a second surface opposing the first surface; a firstvia extending through the first semiconductive substrate from the secondsurface to a surface of the first interconnect structure wherein thefirst via has a bottom portion of the first via filled with a firstconductive material extending from a first sidewall of the first via toa second sidewall of the first via; a second conductive material overthe first conductive material, wherein the second conductive materialfills an upper portion of the first via extending from the firstsidewall of the first via to the second sidewall of the first via,wherein the second conductive material extends over a top surface of adielectric on each of a first and second side of the first via; an underbump metallization (UBM) layer over the first metal layer; and aconnector over the UBM layer.
 18. The semiconductor structure of claim17, wherein the connector is a wire bond or a solder bump.
 19. Thesemiconductor structure of claim 17, wherein the first sidewall and thesecond sidewall of the first via are defined by the dielectric.
 20. Thesemiconductor structure of claim 17, wherein a ratio of Young's modulusbetween the first and second conductive layers is from about 1.5 toabout 3.5.